Invention Grant
- Patent Title: Substrate processing system
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Application No.: US15646230Application Date: 2017-07-11
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Publication No.: US10236196B2Publication Date: 2019-03-19
- Inventor: Yukiyoshi Saito , Kumpei Tada
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2013-236272 20131114
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677

Abstract:
A substrate processing system is provided. The substrate processing system includes: a first transfer apparatus; at least two first accommodating units including an upper first accommodating unit and a lower first accommodating unit; multiple first substrate processing units, which are divided into at least a first group and a second group and arranged in a height direction; an upper second accommodating unit corresponding to the first group; an upper second transfer apparatus corresponding to the first group; a lower second accommodating unit corresponding to the second group; a lower second transfer apparatus corresponding to the second group; a first delivery apparatus corresponding to the first group; and a second delivery apparatus corresponding to the second group.
Public/Granted literature
- US20170309504A1 SUBSTRATE PROCESSING SYSTEM Public/Granted day:2017-10-26
Information query
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