Invention Grant
- Patent Title: Apparatus and method for reducing wafer warpage
-
Application No.: US15467342Application Date: 2017-03-23
-
Publication No.: US10236224B2Publication Date: 2019-03-19
- Inventor: Chang Ho Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2016-0117729 20160913
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L21/66 ; H01L21/324 ; H01L21/67

Abstract:
An apparatus and a method for reducing wafer warpage are provided. The method includes positioning a mold wafer structure on a stage. The mold wafer structure includes a mold layer and a stack structure positioned on a wafer. The stage includes a center region and an edge region adjacent the center region. Warpage information of the mold wafer structure is obtained. The mold wafer structure is heated by the stage based on the warpage information to reduce a warpage of the mold wafer structure. A temperature of the center region and a temperature of the edge region are different from each other. An operation test is performed on the stack structure.
Public/Granted literature
- US20180076098A1 APPARATUS AND METHOD FOR REDUCING WAFER WARPAGE Public/Granted day:2018-03-15
Information query
IPC分类: