Invention Grant
- Patent Title: Electronic component mounting board, electronic device, and electronic module
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Application No.: US15882330Application Date: 2018-01-29
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Publication No.: US10236228B2Publication Date: 2019-03-19
- Inventor: Akihiko Funahashi
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2017-086407 20170425
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L23/13 ; H01L33/48 ; H01L33/62 ; H01L23/053 ; H01L23/373 ; H01L23/498 ; H01L23/544 ; H01L27/146
Abstract:
An electronic component mounting board reduces shadows produced along its perimeter to improve the mountability of an electronic device and an electronic module. An electronic component mounting board (1) includes a substrate (2a) including a mount area (4) in which an electronic component (10) is mountable. The substrate (2a) includes electrode pads located at ends of the mount area (4) as viewed from above. The electronic component mounting board (1) includes a frame (2b) located outside the electrode pads (3) on the upper surface of the substrate (2a). The frame (2b) includes at least one side surface that slopes from an upper end to a lower end of the frame (2b), and flares from the upper end to the lower end as viewed from above.
Public/Granted literature
- US20180308777A1 ELECTRONIC COMPONENT MOUNTING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE Public/Granted day:2018-10-25
Information query
IPC分类:
