An apparatus includes a multilayer package substrate having a plurality of layers. The apparatus also includes a first heat sink disposed over the package substrate. The first heat sink is configured to connect to a semiconductor device and to provide an electrical ground for the semiconductor device. The apparatus includes a second heat sink disposed in the package substrate. The first heat sink overlaps substantially all of the first electrically conductive layer and no dielectric material exists in the multilayer package substrate in a region of contact of the first heat sink and the first electrically conductive layer.