An electronic component includes an electronic device, a mounting member for mounting the electronic device and having a first connecting portion electrically coupled to the electronic device and a second connecting portion, and a sealing member covering the electronic device and the first connecting portion. The mounting member includes a substrate having a mounting surface mounting the electronic device, a first conductive layer disposed on the mounting surface, and a second conductive layer. The first conductive layer includes a first conductive pattern having the first connecting portion and a second conductive pattern having the second connecting portion and spaced apart from the first conductive pattern in a second direction along the mounting surface. The second conductive pattern is connected to the first conductive pattern through a third conductive pattern included in the second conductive layer. The sealing member does not cover the second conductive pattern.