Invention Grant
- Patent Title: Semiconductor device including vertically integrated groups of semiconductor packages
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Application No.: US15620471Application Date: 2017-06-12
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Publication No.: US10236276B2Publication Date: 2019-03-19
- Inventor: Yangming Liu , Chin-Tien Chiu , Zhongli Ji , Shaopeng Dong , Zengyu Zhou
- Applicant: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
- Current Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Vierra Magen Marcus LLP
- Priority: CN201710224640 20170407
- Main IPC: H01L25/10
- IPC: H01L25/10 ; H01L25/04 ; H01L25/07 ; H01L25/11 ; H01L25/065 ; H01L25/00 ; H01L25/075
Abstract:
A semiconductor device is disclosed including at least first and second vertically stacked and interconnected groups of semiconductor packages. The first and second groups of semiconductor packages may differ from each other in the number of packages and functionality.
Public/Granted literature
- US20180294251A1 SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTEGRATED GROUPS OF SEMICONDUCTOR PACKAGES Public/Granted day:2018-10-11
Information query
IPC分类:
