Invention Grant
- Patent Title: Semiconductor light emitting device and method of manufacturing the same
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Application No.: US15718484Application Date: 2017-09-28
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Publication No.: US10236414B2Publication Date: 2019-03-19
- Inventor: Dong Yul Lee , Jung Kyu Park , Jae Sung Hyun
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2016-0157666 20161124
- Main IPC: H01L33/24
- IPC: H01L33/24 ; H01L33/00 ; H01L33/06 ; H01L33/32 ; H01L33/44 ; H01L33/46 ; H01L33/40 ; H01L33/42 ; H01L33/02 ; H01L33/48 ; H01L33/62

Abstract:
A semiconductor light emitting device and a method of manufacturing a semiconductor light emitting device, the device including a first conductive semiconductor layer including a plurality of V-shaped recesses; an active layer on the first conductive semiconductor layer along a shape of the plurality of V-shaped recesses; a second conductive semiconductor layer on the active layer; a reflection assisting layer on the second conductive semiconductor layer; and a reflection layer on the reflection assisting layer, wherein a thickness of the second conductive semiconductor layer is 45 nm to 100 nm.
Public/Granted literature
- US20180145216A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-05-24
Information query
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