Invention Grant
- Patent Title: Light emitting device package
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Application No.: US14817732Application Date: 2015-08-04
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Publication No.: US10236427B2Publication Date: 2019-03-19
- Inventor: Ki Hyun Kim
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2014-0100524 20140805
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/50 ; H01L33/38 ; H01L33/60 ; H01L33/36

Abstract:
Embodiments provide a light emitting device package including a first lead frame and a second lead frame, a light emitting device electrically connected to each of the first lead frame and the second lead frame, the light emitting device having a first electrode pad asymmetrically formed on a top surface thereof, and a reflective member disposed around the light emitting device to reflect light emitted from the light emitting device. The reflective member is configured such that a standard deviation of tilts of a reflective surface of a first area, in which the first electrode pad is disposed, is greater than a standard deviation of tilts of a reflective surface of a second area opposite to the first area.
Public/Granted literature
- US20160043293A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2016-02-11
Information query
IPC分类: