Invention Grant
- Patent Title: Press-fit terminal
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Application No.: US15567422Application Date: 2016-03-09
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Publication No.: US10236603B2Publication Date: 2019-03-19
- Inventor: Hideki Goto
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Yokkaichi, Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie
- Agency: Honigman LLP
- Priority: JP2015-087643 20150422
- International Application: PCT/JP2016/057355 WO 20160309
- International Announcement: WO2016/170865 WO 20161027
- Main IPC: H01R12/58
- IPC: H01R12/58 ; H01B5/02 ; H01R13/03 ; H01R43/16

Abstract:
Provided is a press-fit terminal configured to secure a warp of press-contact portions and reduce insertion force required to insert the press-contact portion into the through hole, without increasing the number of components and manufacturing costs. In a press-fit terminal one end portion of a Rod-Shaped Metal Member (“RSMM”) is provided with press-contact portions configured to be press-fitted into a through hole of a printed board and electrically connected to a conductor, and the other end portion of the rod-shaped metal member includes a connection portion configured to be connected to a partner member, the one end portion of the RSMM has: squashed portions; and the press-contact portions that protrude outward from the squashed portions, and each press-contact portion is configured to deform in a circumferential direction of the RSMM due to contact pressure applied when the press-contact portions are pressed against the through hole.
Public/Granted literature
- US20180123267A1 PRESS-FIT TERMINAL Public/Granted day:2018-05-03
Information query
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