Invention Grant
- Patent Title: Electrical interfaces using modular VPX technologies
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Application No.: US15816724Application Date: 2017-11-17
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Publication No.: US10236611B2Publication Date: 2019-03-19
- Inventor: Carlos Peralta , Kevin M. Nakano , Christal J. Sumner , John P. Norbutas
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: RAYTHEON COMPANY
- Current Assignee: RAYTHEON COMPANY
- Current Assignee Address: US MA Waltham
- Agency: Cantor Colburn LLP
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/79 ; H05K1/14 ; H01R12/73 ; H01R12/71

Abstract:
A printed circuit board assembly and method for electrically communicating between a first printed circuit board and a second printed circuit board is disclosed. The method includes coupling the first printed circuit board to the second printed circuit board via an electrical communication cable. The electrical communication cable includes a VPX-compliant electrical interface, a flat flex interface, and a flexible cable that electrically couples the VPX-compliant electrical interface to the flat flex interface; and electrically communicating over the electrical communication cable.
Public/Granted literature
- US20180145435A1 ELECTRICAL INTERFACES USING MODULAR VPX TECHNOLOGIES Public/Granted day:2018-05-24
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