Invention Grant
- Patent Title: Solid laser amplification device
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Application No.: US15578301Application Date: 2016-06-08
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Publication No.: US10236655B2Publication Date: 2019-03-19
- Inventor: Yoshiyuki Kondo , Yuichi Otani , Yoshiteru Komuro , Atsushi Kodama , Koichi Hamamoto , Hiroyuki Daigo , Naoki Inoue , Tomoya Morioka , Masahiro Kato , Shingo Nishikata
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2015-204803 20151016
- International Application: PCT/JP2016/067059 WO 20160608
- International Announcement: WO2017/064880 WO 20170420
- Main IPC: H01S3/042
- IPC: H01S3/042 ; H01S3/063 ; H01S3/10 ; H01S3/06 ; H01S3/16 ; H01S3/23 ; H01S3/00 ; H01S3/02 ; H01S3/04

Abstract:
A solid laser amplification device having a laser medium that has a solid medium, into which a laser light enters and from which the laser light is emitted, and an amplification layer, provided on the surface of the medium, receives the laser light in the medium, and amplifies and reflects the light toward the exit; and a microchannel cooling part that has a plurality of cooling pipelines, into which a cooling solvent is conducted and which are arranged parallel to the surface of the amplification layer, and a cooling surface, at the outer periphery of the cooling pipelines and attached on the surface of the amplification layer, the microchannel cooling part cooling the amplification layer. The closer the position of the cooling pipeline to a position facing a section of the amplification layer that receives the laser light, the greater the cooling force exhibited by the cooling part.
Public/Granted literature
- US20180145474A1 SOLID LASER AMPLIFICATION DEVICE Public/Granted day:2018-05-24
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