Invention Grant
- Patent Title: Coil segment manufacturing apparatus
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Application No.: US15856297Application Date: 2017-12-28
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Publication No.: US10236752B2Publication Date: 2019-03-19
- Inventor: Kanomi Hayashi , Shinichi Kawano , Daisuke Ueno , Satoru Saito
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2013-174945 20130826
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H02K15/04

Abstract:
A coil segment manufacturing apparatus includes a conducting wire material feeder which repeatedly feeds a conducting wire material while changing the feeding amount and interposing a processing time, a coating remover which removes an insulation coating of the conducting wire material at a removal position each time the processing time is reached, and a conducting wire material cutter which cuts the conducting wire material each time the processing time is reached.
Public/Granted literature
- US20180131260A1 COIL SEGMENT MANUFACTURING APPARATUS AND COIL SEGMENT MANUFACTURING METHOD Public/Granted day:2018-05-10
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