- Patent Title: Multi-stacked electronic device with defect-free solder connection
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Application No.: US15880155Application Date: 2018-01-25
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Publication No.: US10237977B2Publication Date: 2019-03-19
- Inventor: Ai Kiar Ang , Michael Lauri
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Tihon Poltavets
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H05K1/11 ; H05K1/18 ; H05K3/32 ; H05K3/34 ; H05K1/14 ; H01L23/495 ; H01L25/10 ; H01L25/00 ; H01L21/48 ; H05K1/03
Abstract:
A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
Public/Granted literature
- US20180153035A1 MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION Public/Granted day:2018-05-31
Information query
IPC分类:
