Invention Grant
- Patent Title: Component built-in multilayer substrate fabricating method
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Application No.: US14856895Application Date: 2015-09-17
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Publication No.: US10237978B2Publication Date: 2019-03-19
- Inventor: Kuniaki Yosui
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2013-104813 20130517
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/46 ; H01Q1/22 ; H01Q1/12 ; H05K3/30 ; H05K1/16

Abstract:
A fabricating method according to the present disclosure is a component built-in multilayer substrate fabricating method for incorporating a component (12) in a resin multilayer substrate (11) formed by laminating and pressing thermoplastic resin sheets (111a to 111d) so as to crimp them to each other. With the fabricating method according to the present disclosure, a metal pattern (13) is provided on a component mounting surface of the thermoplastic resin sheet (111a). Further, the component (12) is inserted in the area sandwiched by the metal pattern (13). Out of widths relating to the area sandwiched by the metal pattern (13), the width in the component mounting surface side is assumed to be a width W2, and the width in the component-insertion side is assumed to be a width W3, the width W2 being equal to or larger than a width W1 of the component but less than the width W3.
Public/Granted literature
- US20160007480A1 COMPONENT BUILT-IN MULTILAYER SUBSTRATE FABRICATING METHOD AND COMPONENT BUILT-IN MULTILAYER SUBSTRATE Public/Granted day:2016-01-07
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