Invention Grant
- Patent Title: Electronic component
-
Application No.: US15801658Application Date: 2017-11-02
-
Publication No.: US10237991B2Publication Date: 2019-03-19
- Inventor: Nobuyuki Kondo , Toshihiro Niitsu
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agency: Molex, LLC
- Priority: JP2016-230718 20161129
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H05K5/00 ; H05K5/02 ; H01G2/00 ; H01L49/02
Abstract:
An electronic component is provided with a housing, a conductive terminal loaded on the housing, and an external conductive member loaded on the housing. A gap between the external conductive member and the conductive terminal is defined by a protrusion formed on the housing or the external conductive member.
Public/Granted literature
- US20180153045A1 ELECTRONIC COMPONENT Public/Granted day:2018-05-31
Information query
IPC分类:
