An electronic device housing includes a first housing, a second housing, and a foaming buffer unit. The first housing has a first inner surface, and the first inner surface has a first abutting area. The second housing has a second inner surface, where the second inner surface has a second abutting area, the second housing is connected to the first housing, and the second inner surface is opposite to the first inner surface. The foaming buffer unit is disposed between the first inner surface and the second inner surface, and abuts against the first abutting area of the first inner surface and the second abutting area of the second inner surface.