Invention Grant
- Patent Title: Heat dissipating module
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Application No.: US15283442Application Date: 2016-10-02
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Publication No.: US10238006B2Publication Date: 2019-03-19
- Inventor: Xiao-Ju Huang , Zhao-Ping Fu
- Applicant: Wistron Corporation
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: CN201610297234 20160505
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F04D25/06 ; F04D25/14 ; F04D29/60

Abstract:
A heat dissipating module including a casing, a fan, a plurality of blades and at least one locking element is provided. The casing has a first positioning side and a second positioning side opposite each other, and the casing includes a sliding recess located on the first positioning side. The fan is disposed in the casing. The blades respectively slide into the sliding recess and are positioned on the first positioning side and the second positioning side. The locking element passes through the sliding recess to limit the blades from moving out of the sliding recess.
Public/Granted literature
- US20170321721A1 HEAT DISSIPATING MODULE Public/Granted day:2017-11-09
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