Invention Grant
- Patent Title: Polishing pad and polishing method
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Application No.: US15610629Application Date: 2017-06-01
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Publication No.: US10239182B2Publication Date: 2019-03-26
- Inventor: Yi Jian , Wen-Chang Shih , Kun-Che Pai , Chin-Chih Chen
- Applicant: IV Technologies CO., Ltd.
- Applicant Address: TW Taichung
- Assignee: IV Technologies CO., Ltd.
- Current Assignee: IV Technologies CO., Ltd.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: TW105118264A 20160608
- Main IPC: B24B49/12
- IPC: B24B49/12 ; B24B37/24 ; B24B37/20 ; B24B37/013
Abstract:
A polishing pad is provided. The polishing pad includes a polishing layer and a detection window. The detection window is disposed in the polishing layer. The modulus of the detection window is larger than the modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.
Public/Granted literature
- US20170355061A1 POLISHING PAD AND POLISHING METHOD Public/Granted day:2017-12-14
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