Invention Grant
- Patent Title: Multi-component composite structures
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Application No.: US13861652Application Date: 2013-04-12
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Publication No.: US10239289B2Publication Date: 2019-03-26
- Inventor: Bruno Boursier
- Applicant: Hexcel Corporation
- Applicant Address: US CA Dublin
- Assignee: HEXCEL CORPORATION
- Current Assignee: HEXCEL CORPORATION
- Current Assignee Address: US CA Dublin
- Agent W. Mark Bielawski; David J. Oldenkamp
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B29C43/18 ; B32B5/02 ; B32B5/12 ; B32B3/08 ; B32B27/38 ; B29C70/42 ; B29C70/08 ; B29L9/00 ; B29L31/00

Abstract:
A composite assembly that can be cured to form a multi-component composite structure which does not have micro cracks along the boundaries between the various components. The composite assembly includes a structural component and a moldable component wherein the coefficients of thermal expansion of the structural component and the moldable component at the interface or boundary between the two components are such that micro cracks do not form along the interface when the composite assembly is cured to form the multi-component composite structure.
Public/Granted literature
- US20150375481A1 MULTI-COMPONENT COMPOSITE STRUCTURES Public/Granted day:2015-12-31
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