Invention Grant
- Patent Title: Microelectromechanical device with protection for bonding
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Application No.: US14511002Application Date: 2014-10-09
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Publication No.: US10239748B2Publication Date: 2019-03-26
- Inventor: Luca Maggi , Sebastiano Conti
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Law Group LLP
- Priority: ITTO2013A0838 20131016
- Main IPC: H01L41/313
- IPC: H01L41/313 ; B81B7/00 ; B81C1/00 ; H01L23/00 ; B81C3/00 ; H04R19/00
Abstract:
A microelectromechanical device includes: a substrate; a semiconductor die, bonded to the substrate and incorporating a microstructure; an adhesive film layer between the die and the substrate; and a protective layer between the die and the adhesive film layer. The protective layer has apertures, and the adhesive film layer adheres to the die through the apertures of the protective layer.
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