Invention Grant
- Patent Title: Curable composition
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Application No.: US15533940Application Date: 2015-12-08
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Publication No.: US10239989B2Publication Date: 2019-03-26
- Inventor: Kunihiro Noda , Hiroki Chisaka , Yoshinori Tadokoro , Dai Shiota
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki-Shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2014-249323 20141209
- International Application: PCT/JP2015/084451 WO 20151208
- International Announcement: WO2016/093254 WO 20160616
- Main IPC: C08G59/42
- IPC: C08G59/42 ; C08L63/00 ; C08G59/40 ; C08G59/50 ; C08G59/56 ; C08J5/04 ; C08G59/68 ; C08K5/09 ; C08K5/10 ; C08G59/52

Abstract:
A curable composition that can be cured at low temperature in a short time regardless of the type of epoxy compound that is mixed therewith, and has a long pot life; an adhesive comprising said curable composition; a method for producing a fiber-reinforced composite material that uses the curable composition; and a fiber-reinforced composite material containing a matrix comprising the curable composition. A curing agent mixture composition that can be cured at low temperature and in a short time, and provides the curable composition with a long pot life. An epoxy compound (A) and an imidazole compound (B) are blended in with the curable composition. In addition, the imidazole compound (B) and at least one type of crosslinking agent (C) are blended in with the curing agent mixture composition.
Public/Granted literature
- US20170327631A1 CURABLE COMPOSITION Public/Granted day:2017-11-16
Information query
IPC分类: