- Patent Title: Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board
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Application No.: US14414992Application Date: 2013-08-27
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Publication No.: US10240015B2Publication Date: 2019-03-26
- Inventor: Yuki Kitai , Hiroaki Fujiwara
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2012-188336 20120829; JP2012-188337 20120829
- International Application: PCT/JP2013/005060 WO 20130827
- International Announcement: WO2014/034103 WO 20140306
- Main IPC: C08J5/24
- IPC: C08J5/24 ; C08L71/12 ; C08G65/48 ; H05K1/03 ; B32B5/02 ; B32B15/14 ; B32B15/20 ; C09D171/12 ; C08K5/29

Abstract:
A modified polyphenylene ether according to one aspect of the invention has an intrinsic viscosity, as measured in 25° C. methylene chloride, of from 0.03 to 0.12 dL/g, has on molecular ends thereof an average of 1.5 to 3 groups represented by formula (1) below per molecule, and includes not more than 5 mass % of a high-molecular-weight component having a molecular weight of 13,000 or more. In formula (1), R1 is a hydrogen atom or an alkyl group of 1 to 10 carbons, and R2 is an alkylene group of 1 to 10 carbons.
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