Invention Grant
- Patent Title: Packer assembly with thermal expansion buffers and isolation methods
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Application No.: US14655321Application Date: 2014-05-29
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Publication No.: US10240428B2Publication Date: 2019-03-26
- Inventor: Shanu Thottungal Eldho
- Applicant: Halliburton Energy Services, Inc.
- Applicant Address: US TX Houston
- Assignee: Halliburton Energy Services, Inc.
- Current Assignee: Halliburton Energy Services, Inc.
- Current Assignee Address: US TX Houston
- Agent Chamberlain Hrdlicka
- International Application: PCT/US2014/039957 WO 20140529
- International Announcement: WO2015/183277 WO 20151203
- Main IPC: E21B33/128
- IPC: E21B33/128 ; E21B29/00 ; E21B33/12 ; E21B33/129 ; E21B23/06

Abstract:
Systems, methods, and apparatuses for accommodating thermal expansion in a tool string are disclosed. Exemplary systems include one or more sacrificial members placed between or adjacent elements of the tool string that are expected to expand when subjected to high temperatures. The sacrificial members are configured to destruct upon exposure to a control signal or a critical temperature or load. Destruction of the sacrificial members provides additional clearance for adjacent elements to expand.
Public/Granted literature
- US20160258245A1 Packer Assembly with Thermal Expansion Buffers Public/Granted day:2016-09-08
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