Invention Grant
- Patent Title: High conductance valve for fluids and vapors
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Application No.: US14737564Application Date: 2015-06-12
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Publication No.: US10240679B2Publication Date: 2019-03-26
- Inventor: Kim Ngoc Vu
- Applicant: HORIBA STEC, CO., LTD.
- Applicant Address: JP Kyoto-shi, Kyoto
- Assignee: HORIBA STEC, Co., Ltd.
- Current Assignee: HORIBA STEC, Co., Ltd.
- Current Assignee Address: JP Kyoto-shi, Kyoto
- Agency: Alleman Hall Creasman & Tuttle LLP
- Main IPC: F16K1/42
- IPC: F16K1/42 ; F16K1/12 ; F16K31/06

Abstract:
A high conductance valve for use in fluid delivery systems is comprised of a flat non-circular orifice ridge adjacent to which a control plate having a planar control surface is proximally positioned to adjust the valve effective opening area and thereby the conductance of the valve. The length of the non-circular orifice ridge periphery is substantially greater than the circumference of a similarly sized circular orifice and therefore the realized effective opening area is also substantially greater despite having a similar footprint.
Public/Granted literature
- US20150362080A1 HIGH CONDUCTANCE VALVE FOR FLUIDS AND VAPORS Public/Granted day:2015-12-17
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