Invention Grant
- Patent Title: Joint assembly of vapor chambers
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Application No.: US15710116Application Date: 2017-09-20
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Publication No.: US10240873B2Publication Date: 2019-03-26
- Inventor: Chuan-Chi Tseng , Wen-Ching Liao , Ming-Quan Cui
- Applicant: TAI-SOL ELECTRONICS CO., LTD.
- Applicant Address: TW Taipei
- Assignee: TAI-SOL ELECTRONICS CO., LTD.
- Current Assignee: TAI-SOL ELECTRONICS CO., LTD.
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW106126326A 20170804
- Main IPC: F28D15/02
- IPC: F28D15/02 ; F28D15/04

Abstract:
A joint assembly of vapor chambers connects the vapor chambers to effectuate joint operation thereof. For example, two paired vapor chambers are connected therebetween by a capillary pipe and a gas pipe. The capillary pipe is filled with a third wick which connects with a first wick and a second wick in the two vapor chambers. The two vapor chambers are in spatial communication with each other because of the gas pipe. A working fluid in the two vapor chambers is transferred between the first, second and third wicks by capillarity. The gas-phase working fluid moves between the two vapor chambers via the gas pipe, thereby allowing the two vapor chambers to operate jointly.
Public/Granted literature
- US20190041138A1 JOINT ASSEMBLY OF VAPOR CHAMBERS Public/Granted day:2019-02-07
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