An electrochemical measurement device includes a chip, a working electrode, a first connection portion, a substrate, a second connection portion, a third connection portion, and an upper plate. The working electrode is disposed on the upper surface of the chip. The first connection portion is disposed on the upper surface of the chip, and is electrically connected to the working electrode. The second connection portion is disposed on the upper surface of the substrate. The third connection portion is disposed on the substrate, is electrically connected to the second connection portion, and is to be electrically connected to an external apparatus. The upper plate is disposed on the upper surfaces of the substrate and chip. The upper plate is provided with a first through hole through which the working electrode is exposed.