Various embodiments are generally directed to storing data of a three-dimensional (3D) array in a tiled manner in which adjacent rows of adjacent planes are interleaved to enable more efficient retrieval in performing 3D stencil calculations. An apparatus to perform a stencil calculation includes a processor component, a storage communicatively coupled to the processor component, and an interleaving component for execution by the processor component to interleave storage of data of cells of adjacent rows of a first plane with data of cells of adjacent rows of an adjacent second plane of a 3D array among contiguous storage locations of the storage. Other embodiments are described and claimed.