Invention Grant
- Patent Title: Integrated circuit and routing design of the same
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Application No.: US14824576Application Date: 2015-08-12
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Publication No.: US10242148B2Publication Date: 2019-03-26
- Inventor: Lichiu Weng
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/06 ; H01L29/10 ; H01L29/78 ; H01L27/088 ; G06F17/50
Abstract:
The invention provides an integrated circuit. The integrated circuit includes a substrate having a first cell region and a second cell region. A first electronic device is disposed on the substrate in the first cell region. A second electronic device is disposed on the substrate in the second cell region. A first bottommost metal pattern overlaps the first cell region and the second cell region. The first bottommost metal pattern is coupled to the first electronic device and the second electronic device.
Public/Granted literature
- US20160055290A1 INTEGRATED CIRCUIT AND ROUTING DESIGN OF THE SAME Public/Granted day:2016-02-25
Information query
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