Invention Grant
- Patent Title: Fingerprint sensor having printed circuit board and method of manufacture
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Application No.: US15226238Application Date: 2016-08-02
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Publication No.: US10242243B2Publication Date: 2019-03-26
- Inventor: Woon-Chun Kim , Ga-Young Yoo , Hyung-Mi Jung , Hyun-Chul Jung , Jeong-Bok Kwak , Ji-Hye Shim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0140417 20151006
- Main IPC: G06K9/00
- IPC: G06K9/00 ; H01L21/48 ; H01L23/498

Abstract:
A fingerprint sensor includes a first conductive pattern formed on one side of a core, a second conductive pattern formed on the first conductive pattern, an insulating layer formed between the first conductive pattern and the second conductive pattern, a dielectric layer configured to cover the second conductive pattern, and a protective layer covering the dielectric layer, wherein the protective layer includes a photosetting resin.
Public/Granted literature
- US20170098110A1 FINGERPRINT SENSOR HAVING PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURE Public/Granted day:2017-04-06
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