Invention Grant
- Patent Title: Integrated device dies and methods for singulating the same
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Application No.: US15625122Application Date: 2017-06-16
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Publication No.: US10242912B2Publication Date: 2019-03-26
- Inventor: Craig Ventola , Robert O. Doherty , Jose A. Santana , John A. McHatton
- Applicant: ANALOG DEVICES, INC.
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H01L21/304
- IPC: H01L21/304 ; H01L21/78 ; H01L23/544
Abstract:
Integrated device dies and methods for forming one or more of the integrated device dies are disclosed. The integrated device dies can be formed using two step sawing process; a first sawing step partially sawing a substrate comprising metal and a second sawing step sawing through a remaining thickness of the substrate.
Public/Granted literature
- US20180012803A1 INTEGRATED DEVICE DIES AND METHODS FOR SINGULATING THE SAME Public/Granted day:2018-01-11
Information query
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