Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
-
Application No.: US15075775Application Date: 2016-03-21
-
Publication No.: US10243081B2Publication Date: 2019-03-26
- Inventor: Shunpei Yamazaki , Junichi Koezuka , Kenichi Okazaki , Terumasa Ikeyama , Katsuaki Tochibayashi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2012-013451 20120125
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66 ; H01L29/49 ; H01L21/385 ; H01L29/04

Abstract:
A highly reliable semiconductor device including a transistor using an oxide semiconductor is provided. In a semiconductor device including a bottom-gate transistor including an oxide semiconductor layer, a first insulating layer is formed in contact with the oxide semiconductor layer, and an oxygen doping treatment is performed thereon, whereby the first insulating layer is made to contain oxygen in excess of the stoichiometric composition. The formation of the second insulating layer over the first insulating layer enables excess oxygen included in the first insulating layer to be supplied efficiently to the oxide semiconductor layer. Accordingly, the highly reliable semiconductor device with stable electric characteristics can be provided.
Public/Granted literature
- US20160284855A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2016-09-29
Information query
IPC分类: