Invention Grant
- Patent Title: Sensor subassembly and method for sending a data signal
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Application No.: US15457014Application Date: 2017-03-13
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Publication No.: US10243724B2Publication Date: 2019-03-26
- Inventor: Klaus Grambichler , Simon Hainz , Catalina-Petruta Juglan
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Eschweiler & Potashnik, LLC
- Priority: DE102014101754 20140212
- Main IPC: H04L7/00
- IPC: H04L7/00 ; H04Q9/00 ; H04L12/927

Abstract:
A sensor device includes a memory circuit and a transmission circuit. The transmission circuit sends a first data signal to an external receiver in a first state of a read-out-mode of the sensor device, if an oscillation period of the oscillating quantity is longer than a period threshold. Further, the transmission circuit sends a second data signal to the external receiver in a second state of the read-out-mode, if the oscillation period of the oscillating quantity is shorter than the period threshold. The second data signal contains information on at least one of a first local extremum sensor data value and a succeeding second local extremum sensor data value.
Public/Granted literature
- US20170195754A1 SENSOR SUBASSEMBLY AND METHOD FOR SENDING A DATA SIGNAL Public/Granted day:2017-07-06
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