A microwave device can include a printed circuit board substrate having a first microwave device subcircuit and a microdevice substrate having a second microwave device subcircuit. The first microwave device subcircuit may be formed at a low resolution and a low tolerance, while the second microwave device subcircuit may be formed at a high resolution and a high tolerance. The first microwave device subcircuit and the second microwave device subcircuit may be electrically coupled using a conductor.