Invention Grant
- Patent Title: Proximity sensor and manufacturing method therefor
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Application No.: US14981185Application Date: 2015-12-28
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Publication No.: US10244638B2Publication Date: 2019-03-26
- Inventor: Jing-En Luan
- Applicant: STMICROELECTRONICS PTE LTD
- Applicant Address: SG Singapore
- Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Seed Intellectual Property Law Group LLP
- Priority: CN201510519136 20150821
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/32 ; H05K3/28 ; H05K3/30

Abstract:
A proximity sensor is provided according to the embodiments of the present disclosure, comprising: a sensor chip; a light-emitting device; a substrate, the sensor chip and the light-emitting device being located on the substrate; a transparent molding material covering a light-emitting surface of the light-emitting device; and a non-transparent molding material separating the transparent molding material from the sensor chip.
Public/Granted literature
- US20170052040A1 PROXIMITY SENSOR AND MANUFACTURING METHOD THEREFOR Public/Granted day:2017-02-23
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