Invention Grant
- Patent Title: Heat dissipating structure and electronic apparatus
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Application No.: US15745730Application Date: 2016-07-28
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Publication No.: US10244668B2Publication Date: 2019-03-26
- Inventor: Yoshihide Nakanishi , Norihiro Yahata , Hisashi Serita , Masaya Koshimuta
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2015-155419 20150805
- International Application: PCT/JP2016/003498 WO 20160728
- International Announcement: WO2017/022221 WO 20170209
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/00 ; H01L23/42 ; H01L23/433 ; H01L23/552 ; H05K7/14 ; H05K9/00 ; H01L23/367 ; H01L23/40
Abstract:
A heat radiation structure includes a heat spreader provided on a heating component mounted on a substrate, a heat sink disposed at a position facing the heat spreader, a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink, and a conductive member electrically connecting the heat spreader and the heat sink.
Public/Granted literature
- US20180199472A1 HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS Public/Granted day:2018-07-12
Information query
