Invention Grant
- Patent Title: Machine for workpiece processing
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Application No.: US14660294Application Date: 2015-03-17
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Publication No.: US10245696B2Publication Date: 2019-04-02
- Inventor: Juergen Doettling , Robert Ganter , Rainer Banholzer
- Applicant: TRUMPF LASER GMBH
- Applicant Address: DE Schramberg
- Assignee: TRUMPF LASER GMBH
- Current Assignee: TRUMPF LASER GMBH
- Current Assignee Address: DE Schramberg
- Agency: Fish & Richardson P.C.
- Priority: DE102012216632 20120918
- Main IPC: B23Q1/66
- IPC: B23Q1/66 ; B23Q11/08 ; B23K26/70

Abstract:
A workpiece processing machine includes a separation device for dividing an operating space into a processing region and at least one additional operating region, a laser processing head configured to process the workpiece, and a rotary workpiece changer having a rotatable workpiece support for transporting the workpiece between the processing region and the at least one additional operating region by an opening. The rotatable workpiece support has a protection wall configured to shield the at least one additional operating region with respect to the processing region. The separation device has a protection element movable between a processing position and a transport position and configured to be in abutment with the protection wall in the processing position to close the opening and spaced apart from the protection wall in the transport position. A spacing between the processing position and the transport position is adjustable based on a dimension of the workpiece.
Public/Granted literature
- US20150196976A1 Machine for Workpiece Processing Public/Granted day:2015-07-16
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