A die compatibility adaptor including a housing and a die cable extending outward from the housing and terminating at a die cable end engageable with a manufacturing die that includes a first proximity sensor configured to output a first proximity signal and a second proximity sensor configured to output a second proximity signal. The die compatibility adaptor further includes a direct cable receptacle communicatively coupled to the die cable, a duplicate cable receptacle, and one or more isolation relays positioned between and communicatively coupled to the duplicate cable receptacle and the die cable, the one or more isolation relays having a closed position and an open position. In the closed position, the duplicate cable receptacle is communicatively coupled to the die cable.