At least one embodiment of a liquid discharge head includes a liquid discharge substrate, a support substrate on which a back surface of the liquid discharge substrate is joined, and a wiring substrate. A second edge of the liquid discharge substrate and at least one third edge that forms a surface of the support substrate and is in contact with the back surface of the liquid discharge substrate, intersect at an intersecting point. A sealing agent for sealing an electric connection portion between the liquid discharge substrate and the wiring substrate extends over a portion of the second edge extending toward at least one second side surface of the liquid discharge substrate from a space on a lower side of the electric connection portion, to reach at least the intersecting point.