Invention Grant
- Patent Title: MEMS device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing MEMS device
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Application No.: US15698459Application Date: 2017-09-07
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Publication No.: US10246321B2Publication Date: 2019-04-02
- Inventor: Masashi Yoshiike
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2016-192983 20160930
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B41J2/14 ; B81C1/00 ; B41J2/16

Abstract:
There is provided a MEMS device including: a substrate having a resin portion that protrudes from one surface thereof and is made of a resin, in which the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, and in which a width of the resin portion is equal to or larger than a width of the first wiring covering the resin portion in a second direction intersecting the first direction.
Public/Granted literature
- US20180093882A1 MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHOD FOR MANUFACTURING MEMS DEVICE Public/Granted day:2018-04-05
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