Invention Grant
- Patent Title: Fusion polypeptide capable of binding simultaneously to VEGF-C and VEGF-D
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Application No.: US15667424Application Date: 2017-08-02
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Publication No.: US10246511B2Publication Date: 2019-04-02
- Inventor: Kwang Hoon Lee , Hyung-Chan Kim , Sang Yeul Han , Seok Kyun Kim , Kyung Eun Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: KR10-2013-0085515 20130719
- Main IPC: C07K19/00
- IPC: C07K19/00 ; C07K14/71 ; A61K38/18 ; C07K16/28
Abstract:
A fusion polypeptide capable of binding simultaneously to angiopoietin 2, VEGF-C and VEGF-D; or capable of binding simultaneously to VEGF-C and VEGF-D, and methods for the preparation and use thereof.
Public/Granted literature
- US20170342153A1 FUSION POLYPEPTIDE INHIBITING VEGF-C, VEGF-D AND/OR ANGIOPOIETIN-2, AND USE THEREOF Public/Granted day:2017-11-30
Information query
