Invention Grant
- Patent Title: Pipe member, heat pipe, and cooling device
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Application No.: US15745873Application Date: 2016-08-02
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Publication No.: US10247485B2Publication Date: 2019-04-02
- Inventor: Takahiro Koda
- Applicant: MARUSAN ELECTRONICS CO., LTD.
- Applicant Address: JP
- Assignee: Marusan Electronics Co., Ltd.
- Current Assignee: Marusan Electronics Co., Ltd.
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: WOPCT/JP2015/079786 20151022
- International Application: PCT/JP2016/072600 WO 20160802
- International Announcement: WO2017/068833 WO 20170427
- Main IPC: F28D15/02
- IPC: F28D15/02 ; F28F1/40 ; F28D1/047 ; F28D15/04

Abstract:
A pipe member is provided that is capable of configuring a heat pipe that can be installed with a high flexibility in accordance with the state of the installation place. A heat pipe configured by using such a pipe member, and a cooling device are also provided. The pipe member includes: an arbitrarily bendable pipe main body whose both ends are closed when used for the heat pipe; a partition wall extended in an axial direction of the pipe main body to partition the inside of the pipe main body into four passages each being utilized as a flow path of the working fluid; and connection paths which allow neighboring passages to communicate with each other out of the four passages.
Public/Granted literature
- US20180216895A1 PIPE MEMBER, HEAT PIPE, AND COOLING DEVICE Public/Granted day:2018-08-02
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