Invention Grant
- Patent Title: Round robin sensing device and method of use
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Application No.: US15215759Application Date: 2016-07-21
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Publication No.: US10247555B2Publication Date: 2019-04-02
- Inventor: Derek Shaeffer , Stanley Wang
- Applicant: InvenSense, Inc.
- Applicant Address: US CA San Jose
- Assignee: InvenSense, Inc.
- Current Assignee: InvenSense, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: G01C19/5776
- IPC: G01C19/5776 ; G01P1/04

Abstract:
A round-robin sensing device is disclosed. The round-robin sensing device comprises a MEMS device, wherein the MEMS device includes first and second sense electrodes. The round-robin sensing device also comprises a multiplexer coupled to the first and second sense electrodes, at least one sense amplifier coupled to the multiplexer, a demodulator coupled to the at least one sense amplifier, and an integrate and dump circuit coupled to the demodulator. Finally, the round-robin sensing device comprises an analog-to-digital converter (ADC) coupled to the de-multiplexer, wherein the multiplexer, the at least one sense amplifier and the demodulator provide a continuous time sense path during amplification that is resettable and wherein the integrate and dump circuit and the ADC provide a discrete time processing path.
Public/Granted literature
- US20160327393A1 ROUND-ROBIN SENSING DEVICE AND METHOD OF USE Public/Granted day:2016-11-10
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