A sensor assembly is provided that allows for a more rapid sensing of thermal changes. In preferred embodiments, the sensor assembly includes a housing, sensor package, bushing, coupling and gasket. The bushing is made from a conductive material like copper or silver and provides a conductive path from the bottom of the sensor package directly into the medium whose temperature is to be sensed or close thereto. A coupling is provided between the conductive bushing the metal housing to prevent heat exchange between the metal housing and the bushing. The gasket is placed in compression and provides a constant force holding the conductive bushing against the bottom of the sensor package.