Invention Grant
- Patent Title: RF tag
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Application No.: US15788109Application Date: 2017-10-19
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Publication No.: US10248904B2Publication Date: 2019-04-02
- Inventor: Shinya Akamatsu , Hironaga Shimizu
- Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Applicant Address: JP Tokyo
- Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Current Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Osha Liang LLP
- Priority: JP2015-086857 20150421
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; G06K19/077 ; H01Q19/22 ; H01Q5/30

Abstract:
An RF tag that includes an inlay (made of an IC chip and an antenna); an auxiliary antenna laminated on the inlay in an insulated state; and a housing that houses the inlay having the auxiliary antenna laminated thereon. Furthermore, the antenna of the inlay forms a loop circuit adjacent to the IC chip, and the auxiliary antenna overlaps part of the loop circuit and is arranged along a longitudinal direction of the inlay such that at least a part of the antenna of the inlay is exposed.
Public/Granted literature
- US20180039878A1 RF TAG Public/Granted day:2018-02-08
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