Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15821762Application Date: 2017-11-23
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Publication No.: US10249357B1Publication Date: 2019-04-02
- Inventor: Wen-Chin Lin , Jhih-Yuan Chen , Syue-Ren Wu , Meng-Hsun Wu
- Applicant: UNITED MICROELECTRONICS CORP. , Fujian Jinhua Integrated Circuit Co., Ltd.
- Applicant Address: TW Hsin-Chu CN Quanzhou, Fujian Province
- Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee Address: TW Hsin-Chu CN Quanzhou, Fujian Province
- Agent Winston Hsu
- Priority: CN201711063266 20171102
- Main IPC: G11C11/24
- IPC: G11C11/24 ; G11C11/403 ; H01L27/108

Abstract:
A semiconductor device includes a substrate having a memory region and a peripheral region defined thereon, wherein the peripheral region comprises at least one transistor, the memory region comprises a plurality of memory cells, each memory cell comprises at least one gate structure and a capacitor structure, a mask layer disposed on the capacitor structure in the memory region, and a dielectric layer disposed on the substrate within the peripheral region, wherein a top surface of the dielectric layer is aligned with a top surface of the mask layer.
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