Invention Grant
- Patent Title: Cooling mechanism utlized in a plasma reactor with enhanced temperature regulation
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Application No.: US14242473Application Date: 2014-04-01
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Publication No.: US10249475B2Publication Date: 2019-04-02
- Inventor: Aniruddha Pal , Victor Calderon , Martin Jeffrey Salinas , Valentin N. Todorow
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C16/00
- IPC: C23C16/00 ; H01L21/306 ; H01J37/32
Abstract:
Embodiments of the invention generally provide a cooling mechanism utilized in a plasma reactor that may provide efficient temperature control during a plasma process. In one embodiment, a cooling mechanism disposed in a plasma processing apparatus includes a coil antenna enclosure formed in a processing chamber, a coil antenna assembly disposed in the coil antenna enclosure, a plurality of air circulating elements disposed in the coil antenna enclosure adjacent to the coil antenna assembly, and a baffle plate disposed in the coil antenna enclosure below and adjacent to the coil antenna assembly.
Public/Granted literature
- US20150279634A1 COOLING MECHANISM UTLIZED IN A PLASMA REACTOR WITH ENHANCED TEMPERATURE REGULATION Public/Granted day:2015-10-01
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