Invention Grant
- Patent Title: Polishing device and polishing method
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Application No.: US14844214Application Date: 2015-09-03
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Publication No.: US10249518B2Publication Date: 2019-04-02
- Inventor: Masayoshi Adachi , Jun Takayasu
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; B24B49/00 ; B24B21/00 ; B24B49/12 ; H01L21/66
Abstract:
According to one embodiment, a polishing device includes a stage holding a wafer, a polishing part polishing a film formed on a circumferential edge portion of the wafer, a detector detecting a residual portion of the film on the circumferential edge portion, a first movable part moving the detector along a surface of the circumferential edge portion; and a controller controlling the polishing part based on a state of the circumferential edge portion detected by the detector.
Public/Granted literature
- US20160260625A1 POLISHING DEVICE AND POLISHING METHOD Public/Granted day:2016-09-08
Information query
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