Invention Grant
- Patent Title: Substrate support assembly for high temperature processes
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Application No.: US15061734Application Date: 2016-03-04
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Publication No.: US10249526B2Publication Date: 2019-04-02
- Inventor: Vijay D. Parkhe
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/687
Abstract:
An electrostatic chuck comprises a ceramic body having a top and a bottom, one or more heating elements disposed in the ceramic body, and one or more electrodes disposed in the ceramic body. The electrostatic chuck further comprises a plurality of objects bonded to the bottom of the ceramic body by a metal bond, wherein collectively the plurality of objects comprise a plurality of features distributed over the bottom of the ceramic body at a plurality of different distances from a center of a circle defined by the bottom of the ceramic body, and wherein a feature of the plurality of features accommodates a fastener.
Public/Granted literature
- US20170256431A1 SUBSTRATE SUPPORT ASSEMBLY FOR HIGH TEMPERATURE PROCESSES Public/Granted day:2017-09-07
Information query
IPC分类:
