Invention Grant
- Patent Title: Method of forming vertical field effect transistors with different gate lengths and a resulting structure
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Application No.: US15723472Application Date: 2017-10-03
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Publication No.: US10249538B1Publication Date: 2019-04-02
- Inventor: Yi Qi , Hsien-Ching Lo , Jianwei Peng , Wei Hong , Yanping Shen , Yongjun Shi , Hui Zang , Ruilong Xie , Kangguo Cheng , Tenko Yamashita , Chun-chen Yeh
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Gibb & Riley, LLC
- Agent Anthony J. Canale
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L27/088 ; H01L21/3213 ; H01L21/311

Abstract:
Disclosed is a method of forming a structure with multiple vertical field effect transistors (VFETs). In the method, lower source/drain regions are formed on a substrate such that semiconductor fins extend vertically above the lower source/drain regions. Lower spacers are formed on the lower source/drain regions and positioned laterally adjacent to the semiconductor fins. Gates, having co-planar top surfaces, are formed on the lower spacers and positioned laterally adjacent to the semiconductor fins. However, process steps are performed prior to gate formation to ensure that the top surfaces of the lower source/drain region and lower spacer of a first VFET are below the levels of the top surfaces of the lower source/drain region and lower spacer, respectively, of a second VFET. As a result, the first VFET will have a longer gate, higher threshold voltage and lower switching speed. Also disclosed is the structure formed according to the method.
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