The present disclosure relates to a semiconductor package having a double-sided heat dissipation structure, and more particularly, to a semiconductor package having a double-sided heat dissipation structure which rapidly transfers high heat generated in a semiconductor chip to substrates exposed to upper and lower surfaces of the package to have excellent dissipation effect.That is, a semiconductor package having a double-sided heat dissipation structure of the present disclosure includes a package body formed by molding, a first substrate which is provided at an inner lower portion of the package body and has a lower surface exposed to the outside of the package body, a semiconductor chip mounted on an upper surface of the first substrate, a lead frame which is attached to the first substrate and extends to the outside of the package body, a second substrate which is provided at an inner upper portion of the package body and has an upper surface exposed to the outside of the package body, a first metal unit in which one side is bonded to an upper surface of the semiconductor chip and the other side is bonded to a lower surface of the second substrate, and a second metal unit in which one side is bonded to an upper surface of the first substrate and the other side is bonded to the lower surface of the second substrate.